Plus -2 More
Developed in collaboration with Rogers Corporation, this low-loss dielectric materials is used for printing components and devices used in wide bandwidth, high frequency communication and sensing systems.
Dielectric Constant: 2.8
Dissipation Factor (@ 24 GHz): 0.0046
Photoresin that prevents static charge build-up on parts in operating conditions up to 284 °C. Electrostatic Discharge (ESD) of small voltages is enough to destroy sensitive electrical components or ignite flammable vapor.
Surface Resistivity: 106Ω/sq
Heat Deflection Temperature (@ 0.455 MPa): 284 °C
High HDT and high stiffness ceramic-fiber reinforced photopolymer tuned for use in tooling applications such as injection molding or thermoforming.
Heat Deflection Temperature (@ 0.455 MPa): > 300 °C
Tensile Strength: 90 MPa