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Developed in collaboration with Rogers Corporation, this low-loss dielectric materials is used for printing components and devices used in wide bandwidth, high frequency communication and sensing systems.
Dielectric Constant: 2.8
Dissipation Factor (@ 24 GHz): 0.0046
High HDT and high stiffness ceramic-fiber reinforced photopolymer tuned for use in tooling applications such as injection molding or thermoforming.
Heat Deflection Temperature (@ 0.455 MPa): > 300 °C
Tensile Strength: 90 MPa